Properly machined thin edges are really sensitive to practically everything.symbolipoint said:
With electroplating, the current is DC, with the correct polarity required to plate metals from the electrolyte onto the edge.Rive said:
"A lie told often enough becomes the truth." Vladimir Lenin.Dullard said:
Sputtering is preferred over electroplating for certain applications because it allows for a more precise and controlled deposition of thin films. Electroplating can result in uneven thickness and poor adhesion, whereas sputtering can produce uniform and highly adherent films.
The advantages of sputtering compared to electroplating include:
No, sputtering and electroplating are two distinct processes with different principles and applications. While both involve depositing thin films onto a substrate, they use different methods to achieve this and have different advantages and limitations.
Sputtering involves bombarding a target material with high-energy particles (usually ions) in a vacuum chamber. This causes atoms from the target material to be ejected and deposited onto a substrate, forming a thin film. The ions used in sputtering can be selected to achieve specific properties in the deposited film.
One potential disadvantage of sputtering compared to electroplating is the higher cost of equipment and materials. Sputtering also requires a vacuum environment, which can be more complex and time-consuming to set up. Additionally, sputtering may not be suitable for all materials and applications, as some materials may not sputter well or may require specialized equipment.